| 填料硬度对环氧模塑料和封装体性能影响的研究 |
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| 引用本文： | 朱恩波,谢广超,贾路方,陈波,钱莹,席军磊. 填料硬度对环氧模塑料和封装体性能影响的研究[J]. 中国集成电路, 2014, 0(3): 53-56 |
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| 作者姓名： | 朱恩波 谢广超 贾路方 陈波 钱莹 席军磊 |
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| 作者单位： | 汉高华威电子有限公司,江苏连云港222006 |
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| 摘 要： | 在环氧模塑料(EMC)各组分中,填料是最主要的成分之一,也是含量最高的组分,对生产设备和封装设备有很严重的磨损。通过研究,对设备的磨损将引入新的Fe3+,降低EMC和封装体的可靠性和操作性;而低硬度填料的EMC则具有良好的耐磨损性,有助于提高EMC的可靠性和操作性。
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| 关 键 词： | 填料硬度 环氧模塑料 封装体 性能 |
The Impact of Filler Rigidity on the Performance of Epoxy Molding Compound and Package |
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| ZHU En-bo,XIE Guang-chao,JIA Lu-fang,CHEN Bo,QIAN Ying,XI Jun-lei. The Impact of Filler Rigidity on the Performance of Epoxy Molding Compound and Package[J]. China Integrated Circuit, 2014, 0(3): 53-56 |
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| Authors: | ZHU En-bo XIE Guang-chao JIA Lu-fang CHEN Bo QIAN Ying XI Jun-lei |
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| Affiliation: | (Henkel Huawei Electronics Co., Ltd., Lianyungang 222006, China) |
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| Abstract: | Filler is one of the most important components of epoxy molding compound （ EMC ）, and makes up the largest percentage of EMC. However, the filler brings serious abrasion on production and package equipments. In this paper, the abrasion between filler and equipments involves new Fe3＋ which reduces the reliability and moldability of EMC. Furthermore, the low rigid filler in EMC has a good abrasion resistance which improves the reliability and moldability of EMC. |
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| Keywords: | Filler Rigidity EMC Package Performance |
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