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| PCB用高频（毫米波）材料与技术概述 | |
| 引用本文： | 林金堵,吴梅珠.PCB用高频（毫米波）材料与技术概述[J].印制电路信息,2010(6):51-58. |
| 作者姓名： | 林金堵 吴梅珠 |
| 作者单位： | 《印制电路信息》编辑部 |
| 摘 要： | 文章概述了商用毫米波PCB材料的选择与技术。目前，商用微波设计走向毫米波体系并强烈要求薄型、高性能的基板材料。 |
| 关 键 词： | 毫米波 信号传输 薄型（芯）基材 粘结材料 积层基材 IC封装基板 |
The Material and Technology of Millimeter Wave for PCB |
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| LIN Jin-du,WU Mei-zhu.The Material and Technology of Millimeter Wave for PCB[J].Printed Circuit Information,2010(6):51-58. | |
| Authors: | LIN Jin-du WU Mei-zhu |
| Institution: | LIN Jin-du WU Mei-zhu |
| Abstract: | The paper describes the selection of suitable material and technology for PCB. Today, commercial microwave design interest in millimeter wave systems is creating strong demands for thin, high- performance substrate materials. |
| Keywords: | millimeter wave signal transmission thin core material adhesive materials build-up materials IC packaging substrate |
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