| 消除温度对倒装键合对准精度影响的方法 |
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| 引用本文： | 张丽娜,韩雷.消除温度对倒装键合对准精度影响的方法[J].半导体技术,2008,33(11). |
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| 作者姓名： | 张丽娜 韩雷 |
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| 作者单位： | 中南大学,现代复杂装备设计与极端制造教育部重点实验室,长沙,410083;中南大学,现代复杂装备设计与极端制造教育部重点实验室,长沙,410083 |
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| 基金项目： | 国家自然科学基金，国家重点基础研究发展计划(973计划)，湖南省自然科学基金面上项目 |
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| 摘 要： | 为消除温度在热超声倒装键合过程中芯片与基板对准精度的影响,必须将因键合加热而引起的图像抖动量控制在亚像素范围内.设计了一套实验方案,通过实验对比,发现在未启用吹气装置时图像间的抖动剧烈,明显受温度影响,不能满足对准精度要求.采用二元二次曲面拟合亚像素法计算了启用吹气装置后图像间的平移,发现图像间整像素级的抖动明显消除,亚像素级的抖动受温度影响小,在键合温度下最大抖动量不超过0.3像素,能满足对准精度要求.该方法为热超声倒装工艺提出了有价值的参考.
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| 关 键 词： | 热超声倒装键合 图像抖动 相关函数 亚像素 曲面拟合 |
Method for Eliminating the Influence of Temperature on the Alignment Precision in Flip-Chip Bonding |
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| Zhang Lina,Han Lei.Method for Eliminating the Influence of Temperature on the Alignment Precision in Flip-Chip Bonding[J].Semiconductor Technology,2008,33(11). |
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| Authors: | Zhang Lina Han Lei |
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| Institution: | Zhang Lina,Han Lei(Key Laboratory of Modern Complex Equipment Design , Extreme Manufacturing,Ministry of Education,Central South University,Changsha 410083,China) |
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| Abstract: | To eliminate the influence of temperature on the alignment precision of chips and substrates in the process of thermosonic flip-chip bonding,the image dithering caused by heating must be controlled in sub-pixel scope.A set of experiments was designed by contrasting two sets of experiments.It was found that the image dithering intensely and significantly affected by temperature when without the pneumatic device,so can not meet the requirement of precision alignment.The sub-pixel method based on binary quadra... |
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| Keywords: | thermosonic flip-chip bonding image dithering correlation function sub-pixel curved surface fitting |
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