Thermal stress measurement of quartz oscillator module packaging

The thermal stress of the quartz oscillator module packaging is investigated using digital-image correlation method (DICM), and the experimental results are given. Under the quartz oscillator module packaging, the quartz oscillator and the Fe−Sn−Cu alloy frame are joined together with the electroconductive adhesive (PI), and the electroconductive adhesive needs to be cured twice at 150°C and 275°C respectively. As the quartz oscillator and the Fe−Sn−Cu alloy frame have a distinct difference in both thermal expansion coefficients and mechanical properties and in process of packaging temperature rises or drops, the thermal stress is yielded easily. While temperature drops, the normal stress at the quartz oscillator edge is a tensile stress, which can make the quartz oscillator fracture. Project supported by the Natural Science Foundation of Tianjin (013605211).