Investigation of electrochemical reactions on copper electrode in Cu4RbCl3I2 solid electrolyte

Investigations are carried out by potentiostatic method. It is found that at potentials ϕ less than 100 mV, a reaction rate of copper deposition is limited by the formation and the three-dimensional growth of copper nuclei and the rate of copper dissolution is limited by a two-dimensional growth of holes in the metal. The rate of nucleus growth was evaluated at 10⁻⁹...10⁻⁶ μm s⁻¹ depending on the potential. At ϕ>120 mV, the reaction rate is limited by charge transport at the exchange current density of 2.7 mA cm⁻² and the anodic transfer coefficient α_a≈ 0.45. The accumulation of a divalent copper phase on Cu/Cu₄RbCl₃I₂ interface at anodic polarization is explained by a parallel course of Cu⁺ − e → Cu²⁺ reaction.