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Filament architectures in AC conductors: the influence of intergrowths |
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| Authors: | J. Everett G. Perkins A. V. Volkozub A. D. Caplin M. Dhall A. Polcari F. Marti Y. B. Huang R. Flü kiger |
| Affiliation: | a Blackett Laboratory, Imperial College, London SW7 2BZ, UK b Departement de Physique de la Matière Condensée (DPMC), Université de Genève, Switzerland |
| Abstract: | Filament isolation is an extremely important factor in multi-filamentary conductors, and attempts have been made to achieve this by incorporating a resistive oxide sheath around individual filaments. However, filament-bridging intergrowths have been observed in conductors with and without the resistive sheath. We present magnetisation results on BSCCO-2223/Ag conductors with different filament configurations, and analyse the data taking into account the effects of magnetic coupling between filaments. All samples studied display some degree of filament bridging. |
| Keywords: | Bi-2223 tape Intergrowth Magnetization Coupling |
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