堆叠封装技术进展

目前电子产品正朝着高集成化、多功能及微型化方向不断发展。堆叠封装(PoP)作为一种新型3D封装技术,在兼容现有的标准表面贴装技术(SMT)的基础上能够实现不同集成电路在垂直方向上堆叠,从而能够提升封装密度,节省PCB板组装空间,缩短互连线路长度。该技术已从初期的低密度双层堆叠发展至当前的高密度多层堆叠,并在互连方式与塑封形式等封装结构及工艺上不断改进,以适应高性能电子产品的发展需求。通过对PoP上层与下层封装体结构及其封装工艺的近期研究成果进行综述,对比分析它们的各自特点与优势,并展望PoP未来发展趋势。

Progress of Package on Package Technology

The development trends of electronic products are high integration and continual miniaturization and multifunction.The package on package(PoP),as a novel 3D package technology,can stack different integrated circuits on the vertical direction based on the current surface mounting technologies(SMT).This can increase packaging density,save PCB assembly space and reduce interconnection length.Now,the package forms have transformed from the low-density and double-stacked to the high-density and multi-stacked.The improvement and innovation of package structures and processes have been carried out continuously in order to adapt the needs of high performance package of electronic products.By analyzing and summarizing recent research efforts for bottom and top PoP structures and technologies,the relevant characteristics and advantages are compared.Finally,the future evolvements of PoP are forecasted.