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Exchange bias studies of NiFe/FeMn/NiFe trilayer by ion beam etching
Authors:V. K.?Sankaranarayanan,D. Y.?Kim,S. M.?Yoon,C. O.?Kim,C. G.?Kim  author-information"  >  author-information__contact u-icon-before"  >  mailto:cgkim@cnu.ac.kr"   title="  cgkim@cnu.ac.kr"   itemprop="  email"   data-track="  click"   data-track-action="  Email author"   data-track-label="  "  >Email author
Affiliation:(1) Department of Materials Engineering & ReCAMM, Chungnam National University, 305-764 Daejeon, South Korea;(2) Microstructure Devices Group, Electronic Materials Division, National Physical Laboratory, Dr. K.S. Krishnan Marg, New Delhi, 110012, India
Abstract:Effect of low energy ion beam etching on exchange bias in NiFe/FeMn/NiFe trilayer is investigated in multilayers prepared by rf magnetron sputtering. Stepwise etching and magnetization measurement of FeMn layer in an NiFe/FeMn bilayer show increase of bias as etching proceeds and FeMn thickness decreases. The bias show a maximum around 7 nm FeMn thickness and then fall sharply below 5 nm, broadly in line with the exchange bias variation at increasing FeMn thickness but in reverse order, particularly at low FeMn thickness. Progressive etching of top NiFe layer in the NiFe/FeMn/NiFe trilayer shows an initial gradual increase in bias followed by a sharp increase below 7 nm thickness of top NiFe layer, with a maximum at 2 nm thickness for both NiFe layers and greater bias for seed NiFe layer.
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