Polyimide/hollow silica sphere hybrid films with low dielectric constant

Abstract

Polyimide (PI)/hollow silica (HS) sphere hybrid films with low dielectric constant values (low-k) were synthesized via thermal imidization process using pyromellitic dianhydride (PMDA)/4,4′-oxydianiline (ODA) as the polymer matrix and HS spheres as inorganic particles with the closed air voids. The monodispersed HS spheres were synthesized via a one-step process, which means that the formation of silica shells and dissolution of the core particles (polystyrene particles) occurs in the same medium. The HS particles have uniform size of ca. 1.5 μm in diameter and ca. 100 nm in shell thickness. PI/HS sphere hybrid films synthesized using mixture of polyamic acid (PAA) and HS spheres prepared via one-pot process, which means that the production of PAA and HS spheres mixture occurs with the polymerization of PMDA and ODA in the same bottle. HS spheres of two different kinds (pristine HS spheres (PHS spheres) and amine-modified HS spheres (AHS spheres)) were used for the preparation of the hybrid films. With the varying contents of AHS spheres in the range of 1–10 wt%, the dielectric constants of the PI/AHS sphere hybrid films were reduced from 3.1 of pure PI to 1.81 by incorporating 5 wt% AHS. The dielectric constants of the PI/PHS sphere hybrid films were reduced to 1.86 by incorporating 5 wt% PHS. Organic–inorganic hybrid porous polyimides may be expected as prime candidates for polymeric insulators due to their high thermal stability, good mechanical properties, solvent resistance, and low-k.