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Evaluation of dislocation energy in thin films
Authors:R.A. Coppeta  D. Holec  H. Ceric  T. Grasser
Affiliation:1. Institute for Microelectronics, Technische Universit?t Wien, A-1040 Wien, Austria.coppeta@iue.tuwien.ac.at;3. Department of Physical Metallurgy and Materials Testing, Montanuniversit?t Leoben, A-8700 Leoben, Austria.;4. Christian Doppler Laboratory for Reliability Issues in Microelectronics at the Institute for Microelectronics, Technische Universit?t Wien, A-1040 Wien, Austria.;5. Institute for Microelectronics, Technische Universit?t Wien, A-1040 Wien, Austria.
Abstract:
Keywords:dislocations  critical thickness  heterostructure
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