Effect of Cu pre‐deposition on the interface structure between the C‐SiC coatings and stainless steel |
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| Authors: | J. F. Du S. Q. Yang D. Ren R. Q. Zhang N. K. Huang |
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| Affiliation: | Key Lab. of Radiation Physics and Technology of Education Ministry of China, Institute of Nuclear Science and Technology, Sichuan University, Chengdu, 610064, P. R. China |
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| Abstract: | The copper dispersion‐strengthened matrix composites (Cu/C? SiC) were fabricated on the stainless steel by using magnetron sputtering and ion‐beam mixing. The pre‐deposition of Cu element is used to modify the interface structure, and hence, to develop the compatibility between Fe substrate and C‐SiC coating. The results show that the copper layer can effectively broaden the transition layer, where the elements of the coating could be completely mixed with the elements of the substrate. The following heat treatment on it can further broaden the transition layer, i.e. heat treatment can provide more compatibility between C‐SiC coating and Fe substrate. Copyright © 2008 John Wiley & Sons, Ltd. |
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| Keywords: | C‐SiC coatings interface structure heat treatment SIMS SEM |
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