| 基于临时键合与解键合技术的THz集成电路研究 |
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| 引用本文： | 曹乾涛,王 斌,路 波,邓建钦,孙建华.基于临时键合与解键合技术的THz集成电路研究[J].微波学报,2015,31(3):93-96. |
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| 作者姓名： | 曹乾涛 王 斌 路 波 邓建钦 孙建华 |
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| 作者单位： | 1. 中国电子科技集团公司第四十一研究所,青岛 266555; 2. 电子测试技术重点实验室,青岛 266555 |
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| 摘 要： | 太赫兹频段部件的工艺实现是决定器件性能的关键环节。从太赫兹频段部件用50mm 超薄石英基片薄膜电路的集成工艺技术难点和可实现性出发,重点介绍了一种灵活快速的解决方案———临时键合与解键合技术。结果表明,临时键合与解键合技术克服了超薄石英基片脆性大、易破碎的弊端,在50mm 及以下厚度超薄石英基片薄膜电路集成中具有很好的应用前景。
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| 关 键 词： | 太赫兹 超薄石英基片 临时键合 解键合 薄膜电路 |
Research on Integration Technology for Thin Film Circuits in Terahertz Wave Regime Based on Temporary Bonding and De-bonding Technology |
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| CAO Qian-tao,WANG Bin,LU Bo,DENG Jian-qin,SUN Jian-hua.Research on Integration Technology for Thin Film Circuits in Terahertz Wave Regime Based on Temporary Bonding and De-bonding Technology[J].Journal of Microwaves,2015,31(3):93-96. |
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| Authors: | CAO Qian-tao WANG Bin LU Bo DENG Jian-qin SUN Jian-hua |
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| Institution: | 1. The 41st Institute of China Electronics Technology Group Corporation, Qingdao 266555, China; 2. Science and Technology on Electronic Test & Measurement Laboratory, Qingdao 266555, China |
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| Abstract: | Realization of integration technology is the key link of device performance in terahertz wave regime. The difficulty and realizability for integration technology of thin film circuits on 50mm quartz substrate are investigated. As a rapid and flexible detail solution,temporary bonding and de-bonding technology is addressed. It is concluded that temporary bonding and de-bonding technology overcomes the disadvantages of fragility of ultrathin quartz substrate, and has an extensive application prospect in the field of thin film circuit integration on 50mm and even thinner quartz substrate. |
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| Keywords: | THz ultrathin quartz substrate temporary bonding de-bonding thin film circuit |
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