| 埋／盲孔多层PCB制作工艺 |
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| 引用本文： | 翁毅志.埋／盲孔多层PCB制作工艺[J].印制电路信息,2004(4):8-9,20. |
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| 作者姓名： | 翁毅志 |
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| 作者单位： | 陕西咸阳704厂,712099 |
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| 摘 要： | 本文阐述了埋盲孔多层印制板的制作工艺,并对关键工序的控制作了详细说明。
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| 关 键 词： | 埋/盲孔印制板 高密度互连 盲孔 埋孔 |
Manufacturing Technology of Multilayer PCB with Buried/Blind Via |
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| Weng Yizhi.Manufacturing Technology of Multilayer PCB with Buried/Blind Via[J].Printed Circuit Information,2004(4):8-9,20. |
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| Authors: | Weng Yizhi |
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| Abstract: | This article discussed the manufacturing technology of multilayer PCB with buried and blind hole, also explained the key process control in detail. |
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| Keywords: | PCB with buried and blind via high density interconnect(HDI) blind via buried via |
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