| 系统级封装技术现状与发展趋势 |
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| 引用本文： | 陈贵宝,阎山.系统级封装技术现状与发展趋势[J].电子工艺技术,2007,28(5):273-275,279. |
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| 作者姓名： | 陈贵宝 阎山 |
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| 作者单位： | 太原市高新技术产业开发区管委会,山西,太原,030006;太原风华信息装备股份有限公司,山西,太原,030024 |
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| 摘 要： | 目前应用的系统级封装SiP还只是制造商们简单制作的芯片组合体,而今后为了真正普及SiP,还有若干个残留课题,如芯片的测试、多个芯片组合时回路的控制等.叙述SiP技术的现状和将来的展望及课题.
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| 关 键 词： | 系统级封装 芯片组合 芯片测试 |
| 文章编号： | 1001-3474（2007）05-0273-04 |
| 修稿时间： | 2007-06-28 |
Present Situation and Development of SiP Technology |
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| CHEN Gui-bao,YAN Shan.Present Situation and Development of SiP Technology[J].Electronics Process Technology,2007,28(5):273-275,279. |
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| Authors: | CHEN Gui-bao YAN Shan |
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| Institution: | 1. National High - tech Industrial Development Zones of Taiyuan, Taiyuan 030006, China; 2. Taiyuan Fenghua Information - Equipment Co., Ltd., Taiyuan 030024, China |
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| Abstract: | Now SiP(System-in-Package)application is only the simple chip assembly,but in order to popularize SiP,there are many projects which must be studied,including inspection,circuits control of many chips assembly and so on.Introduce the pressent situation and development of SiP technology. |
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| Keywords: | SiP Chip inspection Chip assembly |
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