Thermodiffusive characteristics of some adhesive,film-forming materials and the component solvents |
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Authors: | M. Popescu V. Matei A. Simion A. Danet |
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Affiliation: | 1. Institute of Construction, Bucharest, Roumania
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Abstract: | The TG curves obtained for various temperatures and evaporation times allowed establishment of the thermodiffusive characterics of the solvents frequently used in adhesive and film-forming materials. Determinations were carried out in air with a flow rate of 51/h, on pure solvents, on mixtures with solvent ratios corresponding to those in the final products, and on the final products. The temperature range of the study was 17–35°, the evaporation period for most cases at each temperature being 25 minutes. The method leads to the evaporation rates of such solvents with an average standard deviation of 4 per cent. |
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