Thermodiffusive characteristics of some adhesive,film-forming materials and the component solvents

The TG curves obtained for various temperatures and evaporation times allowed establishment of the thermodiffusive characterics of the solvents frequently used in adhesive and film-forming materials. Determinations were carried out in air with a flow rate of 51/h, on pure solvents, on mixtures with solvent ratios corresponding to those in the final products, and on the final products. The temperature range of the study was 17–35°, the evaporation period for most cases at each temperature being 25 minutes. The method leads to the evaporation rates of such solvents with an average standard deviation of 4 per cent.