集成铜电极的聚甲基丙烯酸甲脂电泳芯片的制作

在聚甲基丙烯酸甲脂(PMMA)上溅射金属Cu，然后利用光刻、湿法腐蚀的办法制出铜电极。与另一片含有微沟道的PMMA基片热键合，制成集成铜电极的电泳芯片。在电极制作过程中，对Cu表面上覆盖的正性光刻胶的前、后烘烤温度及时间进行了研究。对Cu腐蚀液的选择及其浓度的确定进行了分析。首次提出采用二次曝光的办法去除铜电极表面的光刻胶。为了证明该种方法的可行性，在制作的一种集成铜电极的PMMA芯片上，进行了循环伏安及动态伏安实验，采用安培法对葡萄糖溶液的电泳分析进行检测。

Fabrication of Polymethyl Methacrylate Electrophoresis Chips with Integrated Copper Electrodes

Cu was sputtered onto polymethyl methacrylate (PMMA), and copper electrodes were formed by photolithograph and wet etching; an electrophoresis chip was fabricated by thermally bonding the PMMA with copper electrodes to a PMMA substrate with microchannels. During the course of making electrodes, the temperature and time for pre-bake and hard-bake of positive photoresist on the surface of Cu were studied; the eroding solution of Cu was chosen and its concentration was analyzed; a twice-exposure method was first put forward to remove the photoresist on copper electrodes. In order to demonstrate the feasibility of this method, cyclic and hydrodynamic voltammetry experiments were performed on a PMMA chip with copper electrodes fabricated by this method, and the electrophoresis of a glucose solution was preformed, and detected by amperometric detection.