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32 × 32 SOI CMOS image sensor with pinned photodiode on handle wafer
Authors:Yong-Soo Cho  H Takao  K Sawada  M Ishida  Sie-Young Choi
Institution:(1) Department of Electrical and Electronic Engineering, Toyohashi University of Technology, 441-8580 Toyohashi, Aichi, Japan;(2) School of Electrical Engineering and Computer Science, Kyungpook National University, 1370 Sangyuk-Dong, 702-701 Buk-Gu, Daegu, Republic of Korea
Abstract:We have fabricated a 32 × 32 silicon on insulator (SOI) complementary metal oxide semiconductor (CMOS) active pixel image sensor with a pinned photodiode on a handle wafer. The structure of one pixel is a four-transistor type active pixel sensor (APS) which consists of a reset and a source follower transistor on a seed wafer, and is comprised of a photodiode, a transfer gate, and a floating diffusion on the handle wafer. The photodiode could be optimized for better quantum efficiency and low dark currents because its process on the handle wafer is independent of that of transistors on a seed wafer. Most of the wavelengths are absorbed within the visible range, because the optimized photodiode is located on the handle wafer. The image has been captured by the fabricated 32 × 32 SOI CMOS image sensor with array pixels, vertical scanner, horizontal scanner, and delta-difference sampling circuit.
Keywords:pinned photodiode  SOI image sensor  CMOS image sensor  APS  4 transistor
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