| 陶瓷与金属的活性封接 |
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| 引用本文： | 鲁燕萍.陶瓷与金属的活性封接[J].真空电子技术,2003(4):51-53. |
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| 作者姓名： | 鲁燕萍 |
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| 作者单位： | 北京真空电子技术研究所,北京,100016 |
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| 摘 要： | 对陶瓷与金属Ti-Ag-Cu活性法出现的Ti-Ag-Cu活性合金焊料在不同金属表面的流散性进行了分析，解释了用Ti-Ag-Cu活性合金焊料焊接陶瓷和金属时不能达到真空气密的原因；同时，在实验基础上对溅射镀膜金属化焊接工艺进行了分析。
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| 关 键 词： | Ti-Ag-Cu活性合金焊料 流散性 溅射镀膜 焊接工艺 陶瓷-金属活性封接 |
| 文章编号： | 1002-8935(2003)04-0051-03 |
| 修稿时间： | 2003年7月8日 |
Joining of Ceramic to Metal by Active Metal Brazing |
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| LU Yan-ping.Joining of Ceramic to Metal by Active Metal Brazing[J].Vacuum Electronics,2003(4):51-53. |
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| Authors: | LU Yan-ping |
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| Abstract: | In this paper, the blushing of melted Ti-Ag-Cu alloys on the surfaces of different metals was examined, and the reasons which resulted in nonvacuum-ti ghtness ceramic to metal joints was discussed. Also, the active brazing method t hat involves forming Ti film on ceramic surface by sputtering was investigated. |
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| Keywords: | Ti-Ag-Cu alloys Blushing Film by sputtering |
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