层叠微芯片封装翘曲行为优化分析

本文以某汽车用芯片为研究对象,研究芯片封装过程结构翘曲优化问题.首先采用Taguchi正交实验设计,结合Moldflow 2016微芯片封装模拟软件,分析各因素对芯片封装过程结构翘曲影响程度及影响规律.选择对芯片翘曲影响较大的因素为响应试验因素,芯片翘曲值为响应目标,进行Box-Behnken试验设计,建立响应面试验因...

Warpage optimization analysis of chip packaging process

In this paper,an automotive chip is taken as the research object,and the warpage optimization of chip packaging process is studied.Firstly,Taguchi orthogonal experiment design and Moldflow 2016 simulation software are used to analyze the influence of various factors on the warpage of chip packaging process.A box-Behnken experimental design is carried out to establish the mathematical model of response surface test factors and targets.Using the mathematical model constructed by box-Behnken experimental design,the fitness function of Genetic Algorithm Optimization is defined.Based on Matlab 2016 software genetic algorithm toolbox(GUI),the minimum value of chip package structure warpage and the parameter combination of minimum value are obtained through iterative optimization.According to the minimum warpage of the chip,the original model of the chip is compensated by anti deformation.The practical production shows that the optimization method has high accuracy.