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电子元件散热的优化分析
引用本文:云和明,程林,陈宝明,杜文静. 电子元件散热的优化分析[J]. 工程热物理学报, 2006, 27(3): 496-498
作者姓名:云和明  程林  陈宝明  杜文静
作者单位:山东大学空间热科学技术中心,山东,济南,250061;山东建筑大学,山东,济南,250101
基金项目:国家重点基础研究发展计划(973计划)
摘    要:本文采用CFD技术对小空间中的电子元件的散热进行了研究,模拟了以空气为冷却流体的多种方案下小空间的温度场和速度场,基于场协同原理对其温度场和速度场的协同效果进行了分析。在此基础上提出一种评价电子元件冷却效果的冷却效果数,并以此为指标得出小空间电子元件散热的优化方案和最优间距,为进一步探讨微电子元件的冷却技术打下了基础.

关 键 词:场协同  CFD  电子元件  热设计
文章编号:0253-231X(2006)03-0496-03
修稿时间:2006-01-09

OPTIMIZE ANALYSIS ON THE HEAT DISSIPATION OF ELECTRONIC ELEMENTS
YUN He-Ming,CHENG Lin,CHEN Bao-Ming,DU Wen-Jing. OPTIMIZE ANALYSIS ON THE HEAT DISSIPATION OF ELECTRONIC ELEMENTS[J]. Journal of Engineering Thermophysics, 2006, 27(3): 496-498
Authors:YUN He-Ming  CHENG Lin  CHEN Bao-Ming  DU Wen-Jing
Abstract:The heat dissipation of electronic elements in a mini-space is investigated by using Computational Fluid Dynamics (CFD) methods in this paper. The velocity and temperature fields of mini-space are simulated on the condition of several schemes with air as fluid. The synergetic effects of temperature and velocity field for mini-space have been analyzed by field coordination principle. Then a cooling effect number has been put forward to evaluate the cooling effects of electronic elements. The optimized scheme of mini-space and optimized space between of electronics has been obtained by comparing the cooling effect number of different schemes, which has established a solid foundation for discussing the cooling techniques of micro-electronic elements further.
Keywords:CFD
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