| 影响板级质量的多种因素 |
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| 引用本文： | 王豫明,曹有旺,王蓓蓓,王昊.影响板级质量的多种因素[J].电子工艺技术,2012(1):1-3. |
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| 作者姓名： | 王豫明 曹有旺 王蓓蓓 王昊 |
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| 作者单位： | 清华大学SMT实验室 |
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| 基金项目： | 国家重大科技专项基金项目(项目编号:02) |
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| 摘 要： | 组装工艺通常是板级产品最关键工艺,SMT将印制板和元器件通过SMT设备组装到一起。如果测试不通过,客户只归罪于最终的组装加工厂,其实影响板级产品质量的不光是组装加工,还有元器件质量、印制板质量以及加工工艺等。通过对一个案例的金相分析,介绍影响板级质量的多种因素和这些因素是如何影响产品质量的。
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| 关 键 词： | 焊点质量 焊点失效 失效分析 金相分析 界面 |
Effect Factors on Quality of Board Level Assembly |
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| WANG Yu-ming,CAO You-wang,WANG Bei-bei,WANG Hao.Effect Factors on Quality of Board Level Assembly[J].Electronics Process Technology,2012(1):1-3. |
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| Authors: | WANG Yu-ming CAO You-wang WANG Bei-bei WANG Hao |
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| Institution: | (SMT Laboratory of Tsinghua University,Beijing 100084,China) |
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| Abstract: | Assembly process is usually a most critical process for board level products,PCB and components are assembled together through SMT process.If the final test of the board level product does not pass,customers only blame the final assembly plant.In fact,the effect factor on the quality of board level products is not only the assembly process,but also component quality,printed board quality and processing technology.Introduce the effect factors on the quality of board level product and how these factors affect the quality of the product based on a case of metallographic analysis. |
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| Keywords: | Quality of solder joint Failure of solder joint Failure analysis Metallographic analysis Interface |
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