| BGA返修工艺 |
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| 引用本文： | 韩满林,赵雄明.BGA返修工艺[J].电子工艺技术,2007,28(4):214-217. |
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| 作者姓名： | 韩满林 赵雄明 |
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| 作者单位： | 南京信息职业技术学院,江苏,南京,210046;南京信息职业技术学院,江苏,南京,210046 |
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| 摘 要： | 表面组装技术(SMT)的应用是电子装联时代的一场革命,随着电子装联的小型化、高密度化的发展,随着无铅焊接工艺的应用,相关的焊接工艺和返修工艺受到了越来越多的挑战.对BGA的种类和封装材料特性做简要说明,重点阐述BGA的返修步骤以及各步骤的具体操作方法.特别介绍了返修工艺中BGA的植球方法以及BGA重整锡球技术的应用.对BGA的返修有针对性地施加一些措施,对相关的返修工艺制程进行改良,寻求一种最佳的工艺方案,有效地抑制缺陷的产生.
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| 关 键 词： | 球栅阵列封装器件 返修 焊膏 植球 |
| 文章编号： | 1001-3474（2007）04-0214-04 |
| 修稿时间： | 2007-06-04 |
BGA Rework Technics |
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| HAN Man-lin,ZHAO Xiong-ming.BGA Rework Technics[J].Electronics Process Technology,2007,28(4):214-217. |
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| Authors: | HAN Man-lin ZHAO Xiong-ming |
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| Institution: | Nanjing College of Information Technology, Nanjing 210046, China |
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| Abstract: | The application of SMT is a revolution of Electronics assembly, along with the miniaturization and high denseness of the electronics assembly development, and together with the application of lead -free,the reflow process is facing more and more challenges. Briely introduce the type and material of the packager, the procedure of the rework of BGA and every step of operation. Specially introduce the application of BGA rework and reballing in the rework process, in order to improve the manufacturing process ,find the best solution and control the defects rate efficiently and effectively. |
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| Keywords: | Ball Grid Array Rework Solder paste Ball placement |
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