| 倒装芯片封装器件开封方法研究 |
| |
| 引用本文： | 何志刚,梁堃,龚国虎,周庆波,王晓敏.倒装芯片封装器件开封方法研究[J].微电子学,2015,45(4):548-551. |
| |
| 作者姓名： | 何志刚 梁堃 龚国虎 周庆波 王晓敏 |
| |
| 作者单位： | 中国工程物理研究院 计量测试中心, 四川 绵阳 621900,中国工程物理研究院 电子工程研究所, 四川 绵阳 621900,中国工程物理研究院 计量测试中心, 四川 绵阳 621900,中国工程物理研究院 计量测试中心, 四川 绵阳 621900,中国工程物理研究院 计量测试中心, 四川 绵阳 621900 |
| |
| 摘 要： | 对倒装芯片封装(Flip-Chip Package)器件开封技术进行了研究。总结了倒装芯片封装的类型、结构和封装材料；从理论上证明了倒装芯片封装器件开封的可能,并找出了限制开封的制约因素；提出了一种倒装芯片封装器件开封方法,通过X射线检查、镶嵌、磨抛和酸刻蚀的综合应用,突破了限制这类器件开封的因素,并证明了该方法的适用性；给出了建议的试验条件,并展示了开封效果。
|
| 关 键 词： | 倒装芯片 DPA 开封方法 镶嵌 磨抛 |
| 收稿时间： | 2014/6/23 0:00:00 |
Research of Delidding Methods for Flip Chip Packaged Devices |
| |
| HE Zhigang,LIANG Kun,GONG Guohu,ZHOU Qingbo and WANG Xiaomin.Research of Delidding Methods for Flip Chip Packaged Devices[J].Microelectronics,2015,45(4):548-551. |
| |
| Authors: | HE Zhigang LIANG Kun GONG Guohu ZHOU Qingbo and WANG Xiaomin |
| |
| Institution: | Metrology and Testing Center of China Academy of Engineering Physics, Mianyang, Sichuan 621900, P.R.China,Institute of Electronic Engineering of China Academy of Engineering Physics, Mianyang, Sichuan 621900, P.R.China.,Metrology and Testing Center of China Academy of Engineering Physics, Mianyang, Sichuan 621900, P.R.China,Metrology and Testing Center of China Academy of Engineering Physics, Mianyang, Sichuan 621900, P.R.China and Metrology and Testing Center of China Academy of Engineering Physics, Mianyang, Sichuan 621900, P.R.China |
| |
| Abstract: | Methods of flip chip packaged devices(FCPD) was studied. The package types, structures and typical package materials were summarized in detail. Moreover,delidding of FCPD had been theoretically proved to be achievable and its limiting factors was confirmed. Particularly, one of the delidding methods for FCPD to defeat the limiting factors was proposed through using X-ray inspecting, potting, grinding, polishing, and strong acid etching. Eventually, the applicability had been proved. The delidding result was shown and the appropriate experimental conditions was recommended. |
| |
| Keywords: | Flip chip DPA Delidding method Potting Grinding and polishing |
|
| 点击此处可从《微电子学》浏览原始摘要信息 |
| 点击此处可从《微电子学》下载免费的PDF全文 |
|
