BGA"枕头效应"焊接失效原因

针对BGA的一类典型的焊接失效模式"枕头效应"选取了一个典型案例进行分析,详细介绍了分析的过程以及采用的手段,通过采用X-ray、金相切片、SEM&EDS和工艺模拟等分析手段,获得了导致BGA"枕头效应"产生的主要原因,即锡膏与焊接工艺不兼容造成其焊接不良.同时,以此总结和分析了其他导致此缺陷的原因和应采取的对策.

Soldering Failure Reasons of BGA Head in Pillow

Present a typical analysis case on soldering failure of BGA such as Head in Pillow(HIP) .The detailed analysis procedure and means such as X-ray inspection,cross section,SEM&EDS and simulated soldering process analysis performed on the samples are introduced.The conclusion is that the root cause of HIP failure is bad compatibility of solder paste and reflow process.Base on some studies and experience of some cases,other cause resulting in HIP Defect and preventive measure are analyzed and summarized.