| CVD金刚石薄膜金属化及其与金属的焊接研究 |
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| 引用本文： | 李新宇,高陇桥,刘征,郭辉.CVD金刚石薄膜金属化及其与金属的焊接研究[J].真空电子技术,2010(4):43-46. |
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| 作者姓名： | 李新宇 高陇桥 刘征 郭辉 |
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| 作者单位： | [1]北京真空电子技术研究所,北京100015 [2]河北激光研究所,石家庄050081 |
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| 摘 要： | 针对CVD金刚石在微波管中的应用特点,提出一种金刚石膜表面金属化新工艺。该工艺采用Ti/Mo/Ni体系和磁控溅射镀膜方法,与无氧铜焊接获得了良好的接合性能,封接件平均抗拉强度大于113.7 MPa。X射线衍射分析证实：经820℃真空热处理,金刚石与钛膜界面形成Ti8C5和TiO。
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| 关 键 词： | CVD金刚石 磁控溅射 接合 抗拉强度 |
Study of Thin Film Metallization and Welding on CVD Diamond |
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| LI Xin-yu,GAO Long-qiao,LIU Zheng,GUO Hui.Study of Thin Film Metallization and Welding on CVD Diamond[J].Vacuum Electronics,2010(4):43-46. |
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| Authors: | LI Xin-yu GAO Long-qiao LIU Zheng GUO Hui |
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| Institution: | 1. Beijing Vacuum Electronics Research Institute, Beijing 100015, China; 2. Institute of Hebei Laser Technology, Shijiazhuang 050081, China) |
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| Abstract: | This paper advanced a new technique about the diamond films surface metalizing for the pur pose of microwave tube applications. Ti/Mo/Ni muhilayer have been deposited on diamond films by mag netron sputtering, which joined with copper and obtained a good jointing capability, the sealing parts aver age tensile strength was above on 113.7 MPa. XRD approved： after 820℃ vacuum heat treatment, inter face between diamond and Ti formed Ti8C5 and TiO. |
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| Keywords: | Chemical vapor deposition diamond Magnetron sputtering Joining Tensile strength |
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