三维微波多芯片组件垂直微波互联技术

三维微波多芯片组件是新一代固态有源相控阵共形天线和智能蒙皮的核心部件。文章详细介绍了实现三维微波多芯片组件最关键的小型化、低插入损耗和高可靠的垂直微波互联技术,对采用毛纽扣结构的无焊接垂直微波互联和采用环氧树脂包封的垂直微波互联、微波传输结构进行了仿真和优化,研发出相应的制作工艺,实现了三维微波多芯片组件微小型化、大工作带宽、低插入损耗和高可靠垂直微波互联。

Vertical Microwave Interconnection Techniques for 3D Microwave Multi Chip Modules

The three dimensional microwave multichip modules (3D MMCMs) are key parts of new generation solid state active phased array conformal antenna and smart skin. In this paper, the miniaturized, low insertion loss and high relia bility vertical microwave interconnection techniques which are most important for realizing 3D MMCMs are described in de tail. The solderless vertical microwave interconnection with fuzz button structure and the vertical interconnection microwave transmission structure with epoxy resin encapsulation were simulated and optimized respectively. The corresponding processes were developed. The miniaturized, wide operation frequency range, low insert loss and high reliable vertical microwave inter connection for 3D MMCMs was realized successfully.