| Sn-58Bi在镀镍层表面的焊接工艺 |
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| 引用本文： | 华根瑞,王海涛,袁晶,王鹏. Sn-58Bi在镀镍层表面的焊接工艺[J]. 电子科技, 2012, 25(7): 139-141 |
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| 作者姓名： | 华根瑞 王海涛 袁晶 王鹏 |
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| 作者单位： | 西安电子工程研究所专业七部,陕西西安,710100 |
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| 摘 要： | 针对镀镍盒体表面易被氧化等原因导致可焊性下降，且可选无铅焊料Sn-58Bi焊膏的情况下，通过在空气中直接加热焊接、借助真空炉在无氧环境中焊接等方式，确认空洞率高与空气中氧气的存在无关。最终通过在焊接过程中另加自配的助焊剂，将焊接后的空洞率控制在5％以内，满足了焊接要求。
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| 关 键 词： | Sn-58Bi 加热台 无氧焊接 助焊剂 |
Soldering Process Investigation on Nickel-plated Used the Sn-58Bi Solder |
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| HUA Genrui,WANG Haitao,YUAN Jing,WANG Peng. Soldering Process Investigation on Nickel-plated Used the Sn-58Bi Solder[J]. Electronic Science and Technology, 2012, 25(7): 139-141 |
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| Authors: | HUA Genrui WANG Haitao YUAN Jing WANG Peng |
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| Affiliation: | (Professional Seven,Xi’an Electronic Engineering Research Institute,Xi’an 710100,China) |
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| Abstract: | Based on the decreasing solderability of the nickel layer because of the oxidation.And the solder is Sn-58Bi,which is lead-free.We weld some aluminium alloy boxes with the plane heater in the air,then weld the others in the vacuum stove without oxygen.These experiments show that the void rate has no connection with the oxygen in the air.We solve the problem by adding flux which is confected by ourselves in the solder Sn-58Bi.And the void rate is within 5%. |
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| Keywords: | Sn-58Bi plane heater oxygen-free soldering flux |
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