单层微通道热沉拓扑结构对芯片中心热点的降温效能研究

通过热流固耦合模拟分析得到了不同微通道结构热沉基底的温度场及微通道内速度场,研究了相同入流功率下不同单层微通道拓扑结构对中心有高热流密度热点芯片的散热能力。结果表明:相同入流功率(0.05W)下,不同结构的散热能力排序由高到低为Y分形、弯曲散射、直散射(双侧出流)、直螺旋、直散射(单侧出流)、圆螺旋、树状分形、直槽结构;采用中心入流可有效降低芯片中心热点附近的温度,对于中心入流的散射结构,采用对称出流结构可提升其流动传热性能;Y分形结构具有良好的流动传热特性,对于热源面和中心热点均具有良好的散热效果。

Research on cooling efficiency of single-chip microchannel heat sink topology for chip center hot spot

The temperature field and the velocity field in the microchannel of the heat sink substrate with different microchannel structures are obtained by the thermal fluid solid coupling simulation.The heat dissipation capacity of the center with high heat flux density is studied under the same inflow power,with different single-layer microchannel topology structures.The results show that when the inflow power is 0.05W,the heat sink capabilities of different microchannel topology structures from high to low are ordered as Y like fractal structure,scattering structure,bend scattering structure,straight scattering structure(bilateral outflow),square spiral structure,straight scattering structure(unilateral outflow),spiral structure,tree like fractal structure and parallel structure.The central inflow structure can effectively reduce the temperature near the center of the center of the chip.For the scattering structure of the central inflow,the flow and heat transfer performance can be improved by using the symmetrical outflow structure.The Y fractal structure has good flow and heat transfer characteristics,and has good heat dissipation effect for the heat source surface and the central hot spot.