Curingof a phenol–formaldehyde–tannin adhesive in the presence of wood |
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Authors: | G. Vázquez J. González-Álvarez G. Antorrena |
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Affiliation: | 1. Department of Chemical Engineering, University of Santiago de Compostela, School of Engineering, Santiago de Compostela, Spain, 15782
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Abstract: | The curing of a phenol–formaldehyde–tannin (PFT) adhesive in the presence of pine or eucalyptus wood has been studied using differential scanning calorimetry. The influence of the adhesive/wood ratio on the activation energy (Ea), the temperature of the maximum of the exothermic peak (Tp) and the enthalpy of the curing process (ΔH) was analysed. Ea, Tp and ΔH of the curing reaction decreased when wood was added in the curing system. The adhesive/wood interaction did not depend significantly on wood species. |
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