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Material properties in thermal-stress analysis
Authors:I Miskioglu  J Gryzagorides  C P Burger
Institution:1. Department of Engineering Science and Mechanics, Iowa State University, 50011, Ames, IA
2. Department of Mechanical Engineering, University of Cape Town, South Africa
Abstract:With simple techniques and not too-costly laboratory equipment, the significant material properties in modeling transient thermal stresses by photothermoelasticity are evaluated. The results are presented for a room-temperature-cured epoxy, a hot-cured epoxy and a polycarbonate. The materials tested are also evaluated on their applicability to a transient-thermal-stress analysis.
Keywords:
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