Thermographic detection of adhesive-bond and interlaminar flaws in composites |
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| Authors: | D W Wilson J A Charles |
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| Institution: | 1. Center for Composite Materials, University of Delaware, 19711, Newark, DE
2. Department of Mechanical Engineering, Ohio State University, 43210, Columbus, OH
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| Abstract: | This paper reports the development of a liquid-crystal passive thermographic technique for the detection of adhesive-bond-line and interlaminar flaws in composite materials. The technique was successfully used for the detection of flaws in three composite systems: E-glass/epoxy, graphite/epoxy and HMC. Thermographic results are compared to ultrasonic C-scan results to assess the relative effectiveness of the new technique. A photomicrographic study was also used to verify the detected flaws and to characterize the type and extent of the actual damage. |
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