微通道液冷冷板散热特性研究

本文研究了3种典型构型微通道冷板的散热特性，分别为冷板盖板与翅片焊接、冷板盖板与翅片不焊接以及翅片双面插排形式。对比了3种不同构型冷板的散热能力并对3种构型冷板的流阻特性进行了研究，发现翅片排布越密集流阻越大，越不利于整个液冷系统的流量分配。研究了冷却液流量对功率芯片温度的影响，发现冷却液流量较小时，流量增加可大幅降低芯片温度，当冷却液流量足够大时，冷却液流量对芯片温度影响不大。通过对不同翅片高度和不同单边厚度的冷板进行研究，发现翅片高度6mm工况下当翅片和盖板间隙0.3mm时冷板散热能力最强，其余厚度冷板翅片盖板间隙0.2mm时散热能力最强。冷板单边厚度越小，传热热阻越小，功率器件温度越低。

Study on Heat Transfer Characteristics of Micro-Channel Cold-Plates

This paper researches the heat transfer performance of three typical micro-channel cold-plates, i.e., cover plate welding to fins, cover plate not welding to fins, and double rows of fins. We compare the heat dissipation capability of the three cold plates and researches the flow resistance characteristics. It is found that the more concentrated the fins are, the more difficult flow distribution is. The effect of liquid flow rate on the temperature distribution of power devices is investigated. It is found that the higher liquid flow rate can reduce the power device temperature under small liquid flow rate. When the liquid flow rate is big enough, the effect of liquid flow rate is small. Through the research of the fin height and thickness of cold plate with respect to heat dissipation capability, we find that when the fin height is 6mm and the gap is 0.3mm, the heat dissipation capability of the cold plate is strongest. The smaller the cold plate height and the thermal resistance are, the lower the power device temperature is.