Institution: | 1. X-FAB Semiconductor Foundries AG, Erfurt, Haarbergstrasse 67, Germany;2. Information Technology Laboratory, Gottfried Wilhelm Leibniz Universitt Hannover, Hannover, Germany;1. Le2i, UMR CNRS 6306, University of Burgundy, 9 Avenue Alain Savary, 21000 Dijon, France;2. Centre National d’Etudes Spatiales (CNES), 18 Avenue Edouard Belin, 31401 Toulouse, France;1. SAGE-ENISo, National Engineering School of Sousse, 4023 University of Sousse, Tunisia;2. Al Leith Engineering College, Umm Al-Qura University, Saudi Arabia;3. ISIM, University of Gabes, 6072 Gabes, Tunisia;4. ESTACA Research Center, 92532 Levallois Perret, Paris, France;5. GPM-UMR CNRS 6634, University of Rouen, 76801 Saint Etienne du Rouvray, France;1. Systems Integration Department, IMB-CNM (CSIC), Campus Universitat Autònoma de Barcelona (UAB), 08193 Bellaterra, Barcelona, Spain;2. BSH Home Appliances Group, Avda. Industria 49, Zaragoza 50016, Spain;1. IMS-Bordeaux, Université de Bordeaux – UMR 5218, 351 cours de la Libération, 33405 Talence, France;2. Information Technology Laboratory, Gottfried Wilhelm Leibniz Universität Hannover, Hannover, Germany;1. University of Vienna, Physics of Nanostructured Materials, Vienna, Austria;2. Materials Center Leoben Forschung GmbH, Leoben, Austria;3. Vienna University of Technology, Faculty of Technical Chemistry, Vienna, Austria |