Thermal and mechanical effects of voids within flip chip soldering in LED packages |
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| Institution: | 1. School of Material Science and Engineering, Harbin University of Science and Technology, Harbin 150040, PR China;2. Beijing Research Centre, Delft University of Technology, Beijing 100083, PR China;3. Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, PR China;4. State Key Laboratory of Solid State Lighting, Changzhou 213161, PR China;5. DIMES Center for SSL Technologies, Delft University of Technology, Delft 2628CT, Netherlands;1. Engineering Product Development Pillar, Singapore University of Technology and Design, Singapore 138 682, Singapore;2. Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA 02139, USA;1. Departament d’Enginyeria Electrònica, Universitat Autònoma de Barcelona, Cerdanyola del Valles, Spain;2. Departamento de Electricidad y Electrónica, Universidad de Valladolid, Valladolid, Spain;3. Department of Chemistry, University of Helsinki, Helsinki, Finland;1. Department of Industrial Engineering DIIn, University of Salerno, Via Giovanni Paolo II 132, 84084 Fisciano, SA, Italy;2. Faculty of Mathematics and Computer Science, FernUniversität Hagen, 58084 Hagen, Germany;1. Information Technology Laboratory LFI, Leibniz Universität Hannover, Schneiderberg 32, 30167 Hannover, Germany;2. X-FAB Semiconductor Foundries AG, Haarbergstrasse 67, 99097 Erfurt, Germany |
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| Abstract: | This paper investigates the effect of void percentage in the solder layer on the shear strength and thermal property of DA3547 packages by SAC soldering technology. X-ray observation and shear tests revealed that the increase of solder paste volume significantly decreases the void percentage in the solder layer and thus improved the shear strength of the packages. Furthermore, packages with lower void percentage showed a lower junction temperature based on the results of IR test and finite element simulation. The temperature difference due to the effect void percentage shows a correlation with the input power. For the DA3547 packages studied in this research, voids show limited influence on the junction temperature under 50 mA, the typical current recommended by Cree. |
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| Keywords: | Flip–chip LED Soldering Thermal properties Simulation |
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