Effect of Stress State on Growth of Interfacial Intermetallic Compounds Between Sn-Ag-Cu Solder and Cu Substrates Coated with Electroless Ni Immersion Au |
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Authors: | SL Ngoh W Zhou JHL Pang |
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Institution: | (1) Singapore Institute of Manufacturing Technology, 71 Nanyang Drive, Singapore, Singapore, 638075;(2) School of Mechanical & Aerospace Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore, Singapore, 639798 |
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Abstract: | Excessive intermetallic compound (IMC) growth in solder joints will significantly decrease the reliability of the joints.
IMC growth is known to be influenced by numerous factors during the component fabrication process and in service. It is reported
that, other than temperature and holding time, stress can also influence the IMC growth behavior. However, no existing method
can be used to study the effect of stress state on IMC growth in a controlled manner. This paper presents a novel method to
study the effect of stress on interfacial IMC growth between Sn-Ag-Cu solder and a Cu substrate coated with electroless Ni
immersion Au (ENIG). A C-ring was used and in-plane bending induced tensile and compressive stresses were applied by tightening
the C-ring. Results revealed that in-plane compressive stress led to faster IMC growth as compared with in-plane tensile stress. |
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Keywords: | Lead-free solder Sn-Ag-Cu isothermal aging intermetallic interface stress effect |
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