Dissociation of PtSi,NiSi and PdGe in presence of Pt,Ni and Pd films,respectively

⁴He⁺ ions backscattering spectrometry and x-ray diffractometry were used to study interactions between PtSi and Pt, NiSi and Ni, PdGe and Pd. Due to the dissociation of the compound the formation of a phase richer in metal was observed to grow at the original compound/metal interface in the temperature range considered, 280–325°C for Pt₂Si, 325°C for Ni₂Si and 180–260°C for Pd₂Ge. The growth kinetics of these new phases (Pt₂Si and Pd₂Ge) follow a parabolic relation between thickness and annealing time. At a given temperature the growth rate of Pt₂Si and Pd₂Ge in compound-metal structure is a factor higher than in the usual semiconductor-metal structure. Partially supported by Consiglio nazionale delle Ricerche (Italy) and by Commission of the European Communities.