光纤固定软钎焊焊点的三维形态模拟

本文在建立光纤固定软钎焊焊点模型及能量边界条件的基础上,利用有限元方法对焊点三维形态进行数值模拟并分析材料及结构等参数对焊点形态的影响规律.基于能量最小原理并利用形态模拟数据,得出钎料量及焊盘尺寸对光纤与焊盘间隙高度的影响规律,以及光纤横向偏移量对回复力的影响规律.研究结果表明:针对一定的焊盘相对尺寸,当钎料量大于临界值,最小间隙高度随着钎料量的增加而成线性增加;光纤横向偏移量小于一定值时,回复力随着偏移量的增加成线性增加.研究结果对于通过调整结构及工艺参数来控制光纤对准偏移具有指导意义.

Simulation of Three-Dimensional Shape of Solder Joint in Optical Fiber Attachment Soldering

A model of Three Dimensional (3-D) shape of solder joint in optical fiber attachment soldering and the energy boundary condition were established.The 3-D shape of solder joint was predicted by employing Finite Element Method (FEM),and the influence of various factors,which include material and manufacture parameters,on 3-D shape of solder joint was discussed.Based on the minimum potential energy theorem and the data from shape simulation,the influence of solder volume and pad size on the stand-off height (SOH) between optical fiber and pad was analyzed,the effects of y-offset on the restoring force were investigated.The results show that the minimum stand-off height increases linearly with the increase of solder volume for certain pad size when solder volume is larger than the critical value.The restoring force increases linearly with the increase of y-offset when the y-offset is smaller than certain value.The above results are of great importance and can be used to control the offset of alignment by modifying the design and manufacture parameters.