| 银粉形貌及表面处理对导电胶性能的影响 |
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| 引用本文： | 万超,王宏芹,杜彬,王玲,符永高,刘昊. 银粉形貌及表面处理对导电胶性能的影响[J]. 电子工艺技术, 2011, 32(2): 72-75 |
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| 作者姓名： | 万超 王宏芹 杜彬 王玲 符永高 刘昊 |
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| 作者单位： | 万超,王宏芹,杜彬,王玲,符永高,WAN Chao,WANG Hong-qin,DU Bin,WANG Ling,FU Yong-gao(中国电器科学研究院,广东广州,510300);刘昊,LIU Hao(哈尔滨工业大学深圳研究生院,广东深圳,518129) |
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| 摘 要： | 利用四点探针和电子万能试验机分别测定了同种树脂体系中不同银粉形貌及银粉表面处理下导电胶的体积电阻率和剪切强度,探索了银粉含量、形状尺寸及表面处理对导电胶性能的影响规律.
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| 关 键 词： | 导电胶 表面处理 体积电阻率 剪切强度 |
Effect of Ag Morphology and Surface Treatment on Electrically Conductive Adhesive |
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| WAN Chao,WANG Hong-qin,DU Bin,WANG Ling,FU Yong-gao,LIU Hao. Effect of Ag Morphology and Surface Treatment on Electrically Conductive Adhesive[J]. Electronics Process Technology, 2011, 32(2): 72-75 |
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| Authors: | WAN Chao WANG Hong-qin DU Bin WANG Ling FU Yong-gao LIU Hao |
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| Affiliation: | WAN Chao1,WANG Hong-qin1,DU Bin1,WANG Ling1,FU Yong-gao1,LIU Hao2(1.China National Electric Apparatus Research Institute,Guangzhou 510300,China2.Harbin Institute of Technology Shenzhen Graduate School,Shenzhen 518129,China) |
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| Abstract: | The bulk resistivity and the shear strength of the electronic conductive adhesive adopted with the different morphology and surface treatment Ag fillers in the same resins was investigated using the Four point probe and the universal material testing machine.The effect of the size,morphology and surface treatment of Ag filler was discussed. |
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| Keywords: | Electrically conductive adhesive Surface treatment Bulk resistivity Shear strength |
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