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涂布法液晶聚合物挠性覆铜板的制备
引用本文:梁立,茹敬宏,伍宏奎.涂布法液晶聚合物挠性覆铜板的制备[J].印制电路信息,2020(1):15-17.
作者姓名:梁立  茹敬宏  伍宏奎
作者单位:国家电子电路基材工程技术研究中心广东生益科技股份有限公司
摘    要:文章介绍了涂布法液晶聚酯(LCP)挠性覆铜板的工艺流程,对比了涂布法和压合法的液晶聚酯挠性覆铜板的性能。相对于压合法液晶聚酯挠性覆铜板,涂布法液晶聚酯挠性覆铜板涂层厚度可自由选择,更易进行产品设计,在各向异性方面要好,并有成本较低的优势。

关 键 词:涂布法液晶聚合物挠性覆铜板  低成本

The manufacture of the LCP film double-side FCCL
Liang Li,Ru Jinhong,Wu Hongkui.The manufacture of the LCP film double-side FCCL[J].Printed Circuit Information,2020(1):15-17.
Authors:Liang Li  Ru Jinhong  Wu Hongkui
Abstract:The process of Casting LCP FCCL is introduced,and the perfomiance of Casting LCP FCCL and Laminated LCP FCCL is compared in this paper.For Casting LCP FCCL,in addition to the advantages of lower cost,the anisotropy of film is better than Laminated LCP FCCL.Furthermore,compared with Laminated LCP FCCL,Casting LCP FCCL is more easily to be designed because the thickness of coating can be chosen freely.
Keywords:Casting LCP FCCL  Lower Cost
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