Solder with discontinuous melting point in semiconductor laser arrays and stacks |
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| Authors: | Dong-ming Cheng Li-jun Wang Yun Liu Yu-lian Cao Li-na Li Fu-bin Gao |
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| Institution: | a Education and Information Center, Changchun Institute of Optics, Fine Mechanics and Physics, The Chinese Academy of Sciences, 140 Renmin Street, Changchun 130022, China;b Laboratory of Excited-state Processes, The Chinese Academy of Sciences, Changchun 130022, China |
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| Abstract: | High power semiconductor laser arrays must be mounted in the epitaxy-side down configuration for good heat transfer and so require a well-controlled solder. Selection of solder is very important in semiconductor laser arrays and stacks. Usually, the solder consists of two layers. The outer layer prevents In from oxidation. A new type of solder with several layers of Au between the two layers of In was made, which constitutes of multi-layer of W/Ni/Au/In/Cu. In packaging, the Au layer in the solder does not melt. Quick temperature decrease can avoid expansion of the solder. The solder cannot oxidize during packaging. |
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| Keywords: | Semiconductor laser Solder Semiconductor laser array |
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