Structural, morphology and electrical properties of layered copper selenide thin film |
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Authors: | J. Ying Chyi Liew Zainal A. Talib W. Mahmood M. Yunus Zulkarnain Zainal Shaari A. Halim Mohd M. Moksin Wan Mohd Yusoff K. Pah Lim |
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Affiliation: | (1) Faculty of Science, Universiti Putra Malaysia, 43400 UPM Serdang, Malaysia |
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Abstract: | Thin films of copper selenide (CuSe) were physically deposited layer-by-layer up to 5 layers using thermal evaporation technique onto a glass substrate. Various film properties, including the thickness, structure, morphology, surface roughness, average grain size and electrical conductivity are studied and discussed. These properties are characterized by X-ray diffraction (XRD), atomic force microscopy (AFM), ellipsometer and 4 point probe at room temperature. The dependence of electrical conductivity, surface roughness, and average grain size on number of layers deposited is discussed. |
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Keywords: | CuSe thin films electrical conductivity surface roughness film thickness grain size |
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