| Abstract: | Bending stress and fracture strength of micromachined structures are the parameters determining the function and life span of microelectromechanical systems (MEMS) and are also indispensable data for MEMS design. This paper reports the results of a study in which a bending stress measurement method based on electromagnetic actuation and Raman spectroscopy has been examined. In this study, an eight‐cantilever mass structure is chosen as the experimental object. The results have indicated that it can accurately measure the bending stresses and fracture strength. Copyright © 2006 John Wiley & Sons, Ltd. |
