| 193 nm深紫外光刻胶用成膜树脂的研究进展 |
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| 引用本文： | 魏孜博,马文超,邱迎昕.193 nm深紫外光刻胶用成膜树脂的研究进展[J].影像科学与光化学,2020(3):409-415. |
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| 作者姓名： | 魏孜博 马文超 邱迎昕 |
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| 作者单位： | 中国石油化工股份有限公司北京化工研究院燕山分院;橡塑新型材料合成国家工程研究中心 |
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| 基金项目： | 中石化总部项目(G3365-2019-Z1912)资助。 |
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| 摘 要： | 本文综述了用于193 nm深紫外光刻胶的主体成膜树脂的种类及常用合成单体的研究进展,包括聚(甲基)丙烯酸酯体系、环烯烃-马来酸酐共聚物(COMA)体系、乙烯醚-马来酸酐共聚物(VEMA)体系、降冰片烯加成聚合物体系、环化聚合物体系、有机-无机杂化树脂体系以及光致产酸剂(PAG)接枝聚合物主链型等,并分析了目前关于曝光、分辨率和抗蚀刻性能方面存在的问题及未来的发展方向。
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| 关 键 词： | 光刻胶 成膜树脂 曝光 分辨率 抗蚀刻性能 |
Development of Matrix Resins for 193 nm Deep UV Photoresist |
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| WEI Zibo,MA Wenchao,QIU Yingxin.Development of Matrix Resins for 193 nm Deep UV Photoresist[J].Imaging Science and Photochemistry,2020(3):409-415. |
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| Authors: | WEI Zibo MA Wenchao QIU Yingxin |
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| Institution: | (Yanshan Branch,Sinopec BRICI,Beijing 102500,P.R.China;Rubber and Plastic Synthesis National Engineering Research Center,Beijing 102500,P.R.China) |
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| Abstract: | The research progress of the main matrix resins and common synthetic monomers for 193 nm deep UV photoresist was reviewed.The film-forming resin includes poly(methyl)acrylate,cycloolefin-maleic anhydride(COMA),ethylene ether-maleic anhydride(VEMA),norborneene addendum polymer,cyclized polymer,organic-inorganic hybrid resin,and PAG graft on polymer backbone.The existing problems about exposure,resolution and etch resistance and the future development direction were also discussed. |
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| Keywords: | photoresist matrix resin exposure resolution etch resistance |
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