Epoxy polymers: effect of the elastomee in the kinetics of polymerization |
| |
| Institution: | 1. Guangdong Provincial Key Laboratory of Technique and Equipment for Macromolecular Advanced Manufacturing, South China University of Technology, Guangzhou 510641, China;2. National Engineering Research Center of Novel Equipment for Polymer Processing, Key Laboratory of Polymer Processing Engineering (SCUT), Ministry of Education, South China University of Technology, Guangzhou 510641, China |
| |
| Abstract: | The polymerization kinetics of three epoxy adhesives HX-205, HX-206 and F-185 was defined by means of thermal analysis techniques (DSC and TMA).It was found that the liquid carboxy-terminated butadiene acrylonitriles (CTBN) and the solid rubber elastomer present in HX-206 and F-185 do not affect the phenomenological kinetics of the isothermal cure process by comparison with HX-205, which contains the same epoxy but no elastomer.It was also found that the isothermal (373 K) cure of these adhesives follows a two-range behaviour, i.e., the phenomelogical order of the cure kinetics is close to zero before and close to one after a “critical” time of cure.The trend of the glass transition temperature Tg vs the cure degree α for HX-206 and F-185 was always below that for HX-205.Tg did not approach the temperature of cure tc for α = 1 for elastomer-added adhesives, whereas HX-205 displayed an almost liear trend, with e.g. Tg = 87° C for α. = 85%. |
| |
| Keywords: | |
| 本文献已被 ScienceDirect 等数据库收录！ |
|
