| SMT制程工艺对Sn-37Pb/Cu焊接界面影响 |
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| 引用本文： | 肖代红,吴金昌,高翔,陈方泉,袁华英,孟晓娜,黄云宇.SMT制程工艺对Sn-37Pb/Cu焊接界面影响[J].电子工艺技术,2005,26(2):71-74. |
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| 作者姓名： | 肖代红 吴金昌 高翔 陈方泉 袁华英 孟晓娜 黄云宇 |
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| 作者单位： | 英顺达科技有限公司研发品保中心,上海,201114 |
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| 摘 要： | 采用扫描电镜(SEM)研究了表面贴装技术制程工艺,包括锡膏黏度、锡膏模板厚度、传送带速度、恒温区保温时间、印刷电路板烘烤处理等对Sn-37Pb/Cu焊接界面层的影响.结果显示,SMT制程工艺并不影响焊接界面金属间化合物层的组成,IMCs主要成分为Cu6Sn5相,但影响了IMCs层的形态与厚度,其中传送带速度影响了Cu6Sn5相的平均直径,而恒温区保温时间则对IMCs层的形态与厚度影响最大.
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| 关 键 词： | 表面贴装技术 制程工艺 焊接界面 金属间化合物层 |
| 文章编号： | 1001-3474(2005)02-0071-03 |
| 修稿时间： | 2005年1月26日 |
Effect of SMT Processing Technology on the Interface Between Sn- 37Pb Solder and Cu pad of PCB |
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| XIAO Dai-hong,WU Jin-Chang,GAO Xiang,CHEN Fang-quan,YUAN Hua-ying,MENG Xiao-na,HUANG Yun-yu.Effect of SMT Processing Technology on the Interface Between Sn- 37Pb Solder and Cu pad of PCB[J].Electronics Process Technology,2005,26(2):71-74. |
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| Authors: | XIAO Dai-hong WU Jin-Chang GAO Xiang CHEN Fang-quan YUAN Hua-ying MENG Xiao-na HUANG Yun-yu |
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| Abstract: | The effects of the surface mount technology (SMT) processing technology, including the solder paste viscosity,stencil thickness,conveyer speed,isothermal time,PCB roasting treatment,on the interface between Sn-37Pb solder and Cu pad of PCB were investigated with scanning electron microscope (SEM).The results show that SMT processing technology did not affect the Cu_6Sn_5 phase in intermetallic compounds (IMCs) layer between Sn-37Pb solder and Cu pad.However, the shape and thickness of IMC layer were changed by SMT processing technology,especially the conveyer speed and isothermal time. |
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| Keywords: | Surface mount technology Process technology Soldering interface Intermetallic compounds layer |
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