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Authors:Shinn-Gwo Hong  Chau-Kai Chan
Institution:Department of Chemical Engineering, Yuan-Ze University, 135 Far-East Road, Nei-Li, Chung-Li 320, Taiwan
Abstract:The effects of epoxidized natural rubber (ENR) on the curing behaviors and adhesive strengths of an epoxy (diglycidyl ether of bisphenol-A) and dicyandiamide/2-methyl imidazole system are studied with differential thermal calorimetry (DSC), scanning electron microscopy (SEM), and Instron tensile testing instrument. From DSC analyses of specimens prepared with unsealed aluminum pans, it is obtained that the reaction exotherm, the time to maximal curing rate, the glass transition temperature, the rate constant, and the reaction order of the epoxy system change with respect to the content of ENR added because of the reaction of ENR with the epoxy system. The results obtained from SEM micrographs indicate that the particle size of the rubber phase increases with increasing the curing temperature and the ENR content. The volume fraction of the separated rubber phase also follows the similar trend except at the high curing temperature which implying that the dissolution of epoxy resin in the ENR phase also depends on the curing temperature and the amount of ENR present. The lap shear strengths of specimens prepared with etched aluminum substrates increase with increasing the curing temperature because of a better cure at a higher temperature, but decrease with increasing the ENR content resulting from an adverse effect of ENR on the mechanical properties of the cured resins.
Keywords:Epoxidized natural rubber  Epoxy  Dicyandiamide  Curing kinetics  Phase separation
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