柔性电子封装结构中夹杂对延展性的影响分析

以岛-桥型柔性电子封装结构为研究对象,从封装材料中夹杂的刚度、位置、封装方式三个方面探讨了夹杂对柔性电子结构延展性的影响。有限元分析结果表明:随着夹杂刚度的增大,桥的最大主应变增大,整体结构最大延伸量可减小30%;夹杂埋藏位置越深,桥顶局部的整体应变水平越大,最大延伸量可减小20%;相对"硬"封装情形,相同的夹杂对"软"封装中桥的最大延伸量的影响更严重。本文所得结论对于柔性电子器件结构的设计和材料选用具有参考和指导意义。

Inclusion effect on the stretchability of encapsulated flexible electronics

The island-bridge structure of encapsulated flexible electronics is mainly studied and the influence of inclusion on the stretchability of encapsulated flexible electronics from three aspects is discussed,that is,the stiffness of inclusion,the position of inclusion and ways of encapsulation.The finite element simulation results show that when the stiffness of inclusion increases,the maximum strain of bridge strengthens,but the maximum value of stetchablity decreases up to 30%;As the depth of the inclusion increases,the whole strain level of local bridge top area increases and the maximum value of stetchablity of the bridge reduced about 20%.Compared with the hard encapsulation,the same inclusion in the soft encapsulation has the larger influence in weakening the maximum value of stetchablity.The conclusions obtained have the reference and guidance significances in designing the flexible electronic structure and choosing the suitable materials.