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LTCC基板上电阻的设计与制造
引用本文:王啸,马涛,李峰.LTCC基板上电阻的设计与制造[J].电子元件与材料,2006,25(8):64-66,69.
作者姓名:王啸  马涛  李峰
作者单位:中国兵器工业第214研究所,安徽,蚌埠,233042;中国兵器工业第214研究所,安徽,蚌埠,233042;中国兵器工业第214研究所,安徽,蚌埠,233042
摘    要:LTCC基板上制造电阻的方式有三种:顶层共烧、顶层后烧和埋层电阻,在实际工作中对于每个产品应根据需要选择电阻的加工方法。虽然都是在LTCC材料上印制浆料形成膜电阻,但所获得阻值、精度、稳定性等特性却不尽相同。通过对制造几种不同厚膜电阻的多种方法的研究,提供了一套在LTCC上电阻设计和制造的新思路。

关 键 词:电子技术  方阻  共烧  后烧  TCR
文章编号:1001-2028(2006)08-0064-03
收稿时间:2006-04-12
修稿时间:2006-04-12

Design and Manufacture of Resistors on LTCC Substrate
WANG Xiao,MA Tao,LI Feng.Design and Manufacture of Resistors on LTCC Substrate[J].Electronic Components & Materials,2006,25(8):64-66,69.
Authors:WANG Xiao  MA Tao  LI Feng
Institution:NORINCO No.214 Institute, Bengbu 233042, China
Abstract:There are mainly 3 ways in manufactuing film-resistors on LTCC substrate: top-layer co-firing, top-layer post-firing and in-bedded resistor-making. In production practice, suitable resistor processing way should be chosen to meet the specific requirements of each part. Although all three ways shall have film-resistors made by printing on the LTCC substrate surface, the resistance value, accuracy and reliablitity varies from each other. An approach and theory are provided in designing and manufacturing film resistors on LTCC.
Keywords:TCR
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