| HDI板通盲孔同时开窗电镀的制作方法 |
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| 引用本文： | 黄海蛟,李学明,叶应才,翟青霞.HDI板通盲孔同时开窗电镀的制作方法[J].印制电路信息,2014(4):183-185. |
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| 作者姓名： | 黄海蛟 李学明 叶应才 翟青霞 |
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| 作者单位： | 深圳崇达多层线路板有限公司,广东 深圳,518132 |
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| 摘 要： | 现阶段通盲孔位于同一层的HDI板，生产流程较长，制作成本较高，文章通过从优化生产流程，缩短生产周期，降低制作难度角度出发，设计出一种通盲孔同时开窗电镀的工艺技术，对通盲孔同时开窗电镀的工艺技术提出一些见解。
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| 关 键 词： | 高密度互连板 盲孔 通孔 开窗电镀 |
A method for simultaneous window and plating for HDI via and blind holes |
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| HUANG Hai-jiao,LI Xue-ming,YE Ying-cai,ZHAI Qing-xia.A method for simultaneous window and plating for HDI via and blind holes[J].Printed Circuit Information,2014(4):183-185. |
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| Authors: | HUANG Hai-jiao LI Xue-ming YE Ying-cai ZHAI Qing-xia |
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| Institution: | HUANG Hai-jiao, LI Xue-ming, YE Ying-cai, ZHAI Qing-xia |
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| Abstract: | Currently, the manufacture process for those HDI PCB with via and blind holes located on the same layer is quite long and the cost is high accordingly. To optimize the process, shorten the period, and reduce the dififculty, this paper ifnds out a technology to window and plate simultaneously for both via and blind holes. |
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| Keywords: | HDI PCB Blind Hole Via Hole Window and Plating |
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