Ion dose and anneal temperature dependent studies of silicon implanted AlxGa1−xN

Electrical and optical activation studies of Al_xGa_1−xN (x = 0.11 and 0.21) implanted with silicon were made as a function of ion dose and anneal temperature. Silicon ions were implanted at 200 keV with doses ranging from 1 × 10¹⁴ to 1 × 10¹⁵ cm⁻² at room temperature. The implanted samples were subsequently annealed from 1100 to 1300 °C for 20 min in a nitrogen environment. A maximum electrical activation efficiency of 91% was obtained for the Al_0.11Ga_0.89N implanted with the highest dose of 1 × 10¹⁵ cm⁻² even after annealing at 1150 °C. 100% activation efficiencies were successfully obtained for the Al_0.21Ga_0.79N samples after annealing at 1300 °C for both doses of 5 × 10¹⁴ and 1 × 10¹⁵ cm⁻². The mobility of the Si-implanted Al_xGa_1−xN increases with annealing temperature, and the highest mobilities are 109 and 98 cm²/V·s for Al_0.11Ga_0.89N and Al_0.21Ga_0.79N, respectively. The cathodoluminescence (CL) spectra for all the samples exhibited a sharp neutral-donor-bound exciton peak, and the CL intensity increases with annealing temperature, indicating successive improved implantation damage recovery as the annealing temperature is increased. These results provide the optimum annealing conditions for activation of implanted Si ions in Al_xGa_1−xN.